Wafer Surface Evaluation - Vision inspection
In semiconductor manufacturing, evaluating wafer cross-section roughness is challenging with traditional image processing. Our client needed an accurate, automated solution to detect surface defects. We built a deep learning system using PaDiM and ResNet-50, trained only on normal samples, to identify anomalies in wafer surfaces—enabling fast, precise, and scalable quality control in production.

Client Problem:
Detect defects on the cross-section of semiconductor wafers. These cross-sections may not be flat and may have rough spots. It is necessary to assess the overall roughness of the whole cutting plate.
Challenge:
Flat or rough or convex cross-section is a judgment based primarily on perception and are difficult to measure.
Using only traditional image processing methods such as measuring brightness, contrast and/or gradient are difficult to evaluate the roughness.
Tech Stack: PyTorch (framework); ResNet-50 (backbone); PaDim (anomaly detection)
Our Solution:
Using Anomaly Detection (Deep Learning) algorithms: Apply to surface images with uniform properties or mesh structure. Areas that are heterogeneous or structurally distinct are considered abnormal regions. The advantage of this approach is that it only needs to train the model with good samples.
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