Case Studies

Case Studies

We have helped 200+ companies transform their business with top-notch tech solutions.

Wafer Surface Evaluation - Vision inspection

AI

We developed a deep learning solution using anomaly detection to evaluate wafer cross-section roughness. By leveraging PaDiM with ResNet-50, our model detects abnormal surface patterns without needing defective samples—enhancing precision and automating quality inspection in semiconductor manufacturing where traditional image processing falls short.

In semiconductor manufacturing, evaluating wafer cross-section roughness is challenging with traditional image processing. Our client needed an accurate, automated solution to detect surface defects. We built a deep learning system using PaDiM and ResNet-50, trained only on normal samples, to identify anomalies in wafer surfaces—enabling fast, precise, and scalable quality control in production.

Wafer Surface Evaluation - Vision inspection

Client Problem:

Detect defects on the cross-section of semiconductor wafers. These cross-sections may not be flat and may have rough spots. It is necessary to assess the overall roughness of the whole cutting plate.

 

Challenge:

Flat or rough or convex cross-section is a judgment based primarily on perception and are difficult to measure.

Using only traditional image processing methods such as measuring brightness, contrast and/or gradient are difficult to evaluate the roughness.

 

Tech Stack: PyTorch (framework); ResNet-50 (backbone); PaDim (anomaly detection)

 

Our Solution:

Using Anomaly Detection (Deep Learning) algorithms: Apply to surface images with uniform properties or mesh structure. Areas that are heterogeneous or structurally distinct are considered abnormal regions. The advantage of this approach is that it only needs to train the model with good samples.

Case studies